By adding CADSTAR Power Integrity Advance module to their high-speed design flow they are now meeting targets for right-the-first-time designs and achieve rapid compliance with power integrity constraints. TEWS Technologies encountered challenges around power distribution onPCBs for their embedded interface modules, due to today’s increasingly complex designs. Zuken’s CADSTAR distribution manager Jeroen Leinders explains how, supported by the right tools, PCB design is becoming the epicentre of today’s electronic product development process. Advanced devices with high density pin-outs and multiple voltage levels are appearing on even the simplest boards. Printed circuit board design is getting tougher.
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